IC Package Engineer Resume

An IC (Integrated Circuit) package engineer is an electronics engineer who handles the tasks of designing and implementing the design for integrated circuit package. The duties of an IC package engineer include designing methodology, system architecture, road mapping, analog design layout, and verification of IC package products. The role also demands concept analysis, developing design specifications, and constraint management of Analog design. The job expects the engineers to best techniques and solutions for electronics products.

To apply for the job, include knowledge of processors and high speed interfaces in the job application. It is necessary to show familiarity with different memory types, and programming languages such as Python, Perl, TCL and Shell script.

IC Package Engineer Resume Example

Career Objective:

Looking for an IC packaging engineer position with an electronics company to contribute my skills for developing and enhancing IC packaging system.

Summary of Skills:

• Experience in designing packaging solutions for semiconductors
• In-depth knowledge of packaging materials and processes
• Ability to perform failure analysis and apply appropriate measures
• Extensive knowledge of microprocessor and high speed interfaces
• Familiarity with different types of memory and physical design process
• Adept wit 2D and 3D Em simulation and power management
• Skilled in using AutoCAD, Cadence, and other design tools

Work Experience:

IC Package Engineer
T-System Networking, Middlesboro, KY
October 2012 - Present

• Coordinate and develop new design technologies for microprocessors
• Develop and implement packaging and assembly processes
• Select and validate packaging materials and processes
• Coordinate with and evaluate vendors and prepare specifications
• Develop and enhance signal and power integrity
• Work closely with the development teams and determine decoupling capacitor requirements
• Ensure products are developing in compliance with set standards and specifications

Junior IC Package Engineer
Magnificent Engineering Company, Middlesboro, KY
March 2010 - September 2012

• Developed and validated packaging interconnect materials and processes
• Prepared specification, test reports, and new tools for testing
• Assisted in the design, development, and testing of microelectronic packaging components
• Assisted in preparing forecast, budget, and mitigate project risk
• Collected feedback from customers and worked on it with development team
• Verified integrated circuit designs and developed simulation
• Identified and removed defects and improved performance and durability of electronics chip

Education:

• Bachelor's Degree in Electrical Engineering
  EC College, Middlesboro, KY
  2009

Reference:

On request.